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Hotmelt-molding

Hotmelt stands out for its clean processing characteristics - naturally without solvents or other harmful substances. Hotmelt is used wherever good adhesion on cable and housing materials, and low processing pressure are required. This process is used for the production of formed parts, the molding of connectors with simultaneous sealing and strain relief as well as the coating of electronic components and mounted circuit boards. The application of low-viscosity molding compound at low pressure also enables the molding of sensitive components such as SMD-mounted PCBs.


Secure adhesion on plastic surfaces (for example PVD, PUR, PP)
Protection type IP62 to IP69, depending on the individual components
Dismounting exclusion
Individual design for customer-specific solution concepts
Reliable couting of components
Low tooling costs enable solutions which could otherwise only be realised cost-effectively with large- series production